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shinkawaen | 18-12-2018 | Hits  44
We will exhibit at "NEPCON JAPAN 2019 - 20th IC & SENSOR PACKAGING TECHNOLOGY EXPO" to be held at Tokyo Big Sight from 16th (Wed) to 18th (Fri) January 2019. During this period, we will be exhibiting the following new products and we would really appreciate if you could visit to our great booth. We are looking forward to seeing you. Theme: Smart Factory Products: New product: Wire Bonder, UTC - 5000NeoCu Super      New product: Small chip Die Bonder, STC-800 (Epoxy Version) For det...
tatsapolza | 19-11-2018 | Hits  63
SEMICON Japan 2018 will be held at Tokyo Big Site from December 12th through 14th . Shinkawa is going to exhibit and demonstrate our main machine. We are looking forward to seeing you at our booth. Booth No. 1206 Hall east Please click http://www.semiconjapan.org for more information.
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